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| AP09N70P/R Advanced Power Electronics Corp. Dynamic dv/dt Rating Repetitive Avalanche Rated Fast Switching Simple Drive Requirement GG S S N-CHANNEL ENHANCEMENT MODE POWER MOSFET D D BVDSS RDS(ON) ID 600/675V 0.75 9A Description AP09N70 series are specially designed as main switching devices for universal 90~265VAC off-line AC/DC converter applications.Both TO-220 and TO-262 G type provide high blocking voltage to overcome voltage surge and sag in the D S toughest power system with the best combination of fast switching,ruggedized design and cost-effectiveness. TO-220(P) The TO-220 and TO-262 package is universally preferred for all commercialindustrial applications. The device is suited for switch mode power supplies ,DC-AC converters and high current high speed switching circuits. G D S TO-262(R) Units V V A A A W W/ mJ A mJ Absolute Maximum Ratings Symbol VDS VGS ID@TC=25 ID@TC=100 IDM PD@TC=25 EAS IAR EAR TSTG TJ Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current 1 Rating - /A 600/675 30 9 5 40 156 1.25 2 Total Power Dissipation Linear Derating Factor Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy Storage Temperature Range Operating Junction Temperature Range 305 9 9 -55 to 150 -55 to 150 Thermal Data Symbol Rthj-c Rthj-a Parameter Thermal Resistance Junction-case Thermal Resistance Junction-ambient Max. Max. Value 0.8 62 Unit /W /W Data & specifications subject to change without notice 200218032 AP09N70P/R Electrical Characteristics@Tj=25oC(unless otherwise specified) Symbol BVDSS Parameter Drain-Source Breakdown Voltage Test Conditions VGS=0V, ID=1mA VGS=0V, ID=1mA BVDSS/Tj Min. 600 675 2 - Typ. 0.6 4.5 44 11 12 19 21 56 24 2660 170 10 Max. Units 0.75 4 10 100 100 V V V/ V S uA uA nA nC nC nC ns ns ns ns pF pF pF //A Breakdown Voltage Temperature Coefficient Reference to 25, ID=1mA RDS(ON) VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss Static Drain-Source On-Resistance Gate Threshold Voltage Forward Transconductance Drain-Source Leakage Current (Tj=25 C) Drain-Source Leakage Current (Tj=150 C) o o VGS=10V, ID=4.5A VDS=VGS, ID=250uA VDS=10V, ID=4.5A VDS=600V, VGS=0V VDS=480V, VGS=0V VGS= 30V ID=9A VDS=480V VGS=10V VDD=300V ID=9A RG=10,VGS=10V RD=34 VGS=0V VDS=25V f=1.0MHz Gate-Source Leakage Total Gate Charge 3 Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance 3 Source-Drain Diode Symbol IS ISM VSD Notes: 1.Pulse width limited by safe operating area. 2.Starting Tj=25oC , VDD=50V , L=6.8mH , RG=25 , IAS=9A. 3.Pulse width <300us , duty cycle <2%. Parameter Continuous Source Current ( Body Diode ) Test Conditions VD=VG=0V , VS=1.5V Tj=25, IS=9A, VGS=0V Min. - Typ. - Max. Units 9 40 1.5 A A V Pulsed Source Current ( Body Diode ) 1 Forward On Voltage 3 Ordering Code AP09N70P(/R)- X : X Denote BVDSS Grade Blank = BVDSS 600V A = BVDSS 675V AP09N70P/R 10 10 T C =25 o C 8 V G =10V V G =6.0V V G =5.0V 8 T C =150 o C V G =10V V G =6.0V V G =5.0V ID , Drain Current (A) 6 ID , Drain Current (A) V G =4.5V 6 4 4 V G =4.5V 2 V G =4.0V 2 V G =4.0V V G =3.5V 0 0 2 4 6 8 10 12 0 0 4 8 12 16 20 24 V G =3.5V V DS , Drain-to-Source Voltage (V) V DS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 1.2 2.8 I D =4.5A 2.4 V G =10V 1.1 2 Normalized BVDSS (V) Normalized R DS(ON) -50 0 50 100 150 1.6 1 1.2 0.8 0.9 0.4 0.8 0 -50 0 50 100 150 T j , Junction Temperature ( o C) T j , Junction Temperature ( C ) o Fig 3. Normalized BVDSS v.s. Junction Temperature Fig 4. Normalized On-Resistance v.s. Junction Temperature AP09N70P/R 10 9 150 8 ID , Drain Current (A) 7 6 100 5 4 3 PD (W) 50 0 2 1 0 25 50 75 100 125 150 0 50 100 150 T c , Case Temperature ( C) Tc , Case Temperature( o C) Fig 5. Maximum Drain Current v.s. Fig 6. Typical Power Dissipation Case Temperature 100 1 DUTY=0.5 10 10us 100us 1ms Normalized Thermal Response (R thjc) 0.2 ID (A) 0.1 0.1 0.05 PDM 0.02 0.01 SINGLE PULSE 1 t T Duty factor = t/T Peak Tj = P DM x Rthjc + TC 10ms T c =25 o C Single Pulse 100ms 0.1 1 10 100 1000 10000 0.01 0.00001 0.0001 0.001 0.01 0.1 1 10 V DS (V) t , Pulse Width (s) Fig 7. Maximum Safe Operating Area Fig 8. Effective Transient Thermal Impedance AP09N70P/R f=1.0MHz 16 10000 14 I D =9A Ciss VGS , Gate to Source Voltage (V) 12 V DS =320V V DS =400V C (pF) V DS =480V Coss 100 10 8 6 Crss 4 2 0 0 10 20 30 40 50 60 70 1 1 5 9 13 17 21 25 29 Q G , Total Gate Charge (nC) V DS (V) Fig 9. Gate Charge Characteristics Fig 10. Typical Capacitance Characteristics 100 5 4 10 IS (A) T j = 25 C o VGS(th) (V) T j = 150 o C 3 2 1 1 0.1 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 0 -50 0 50 100 150 V SD (V) T j , Junction Temperature ( o C) Fig 11. Forward Characteristic of Reverse Diode Fig 12. Gate Threshold Voltage v.s. Junction Temperature AP09N70P/R VDS RD 90% D VDS TO THE OSCILLOSCOPE 0.5x RATED VDS RG G 10% + 10 V S VGS VGS td(on) tr td(off) tf Fig 13. Switching Time Circuit Fig 14. Switching Time Waveform VG VDS TO THE OSCILLOSCOPE QG 10V D G S + 0.8 x RATED VDS QGS QGD VGS 1~ 3 mA IG ID Charge Q Fig 15. Gate Charge Circuit Fig 16. Gate Charge Waveform |
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